Spezifikatioune

• Serie
  XR2
• Package
  Bulk
• Deel Status
  Active
• Typ
  DIP, 0.6" (15.24mm) Row Spacing
• Zuel vu Positiounen oder Pins (Gitter)
  32 (2 x 16)
• pitch - mating
  0.100" (2.54mm)
• Kontakt fäerdeg - mating
  Gold
• Kontakt Finish deck - mating
  10.0µin (0.25µm)
• Kontakt Material - mating
  Beryllium Copper
• Montéierung Typ
  Through Hole
• Eegeschaften
  Open Frame
• Kënnegung
  Solder
• Pitch - Post
  0.100" (2.54mm)
• Kontakt fäerdeg - Post
  Gold
• Kontakt Arrivée deck - Post
  10.0µin (0.25µm)
• Kontakt Material - Post
  Beryllium Copper
• Wunneng Material
  Polybutylene Terephthalate (PBT), Glass Filled
• Betribssystemer Temperatur
  -55°C ~ 125°C